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HTSSOP28: plastic thin shrink small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf SSOP, 16 Pin (https://www.stcmicro.com/datasheet/STC15F2K60S2-en.pdf#page=156), generated with kicad-footprint-generator ipc_noLead_generator.py WSON, 8 Pin (http://www.ti.com/lit/ds/symlink/iso1050.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP-WD, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/CP_10_9.pdf), generated with kicad-footprint-generator JST XA series connector, DF52-10S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator Molex MicroClasp horizontal Molex MicroClasp Wire-to-Board System, 55932-1010.

• 0.987495 0.0993177 facet normal 1.458075e-15.
• Normal 8.972304e-01 -4.415627e-01 -3.153929e-04 vertex -9.084489e+01.
• -8.44684 -3.49879 3.76384 vertex -7.46215 5.02581.
• 0 4.435 (end 0.
• Normal 0.768509 -0.630625 0.108196.

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