3
1
Back

12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x32.04mm 12x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 25.24 mm (993 mils SMD DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of MSOP-16 (see https://www.analog.com/media/en/technical-documentation/data-sheets/3748fb.pdf MFSOP 4 pin connector, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F215079%7FY1%7Fpdf%7FEnglish%7FENG_CD_215079_Y1.pdf%7F215079-4 connector TE-Connectivity Micro-MaTch female-on-board top-entry thru-hole 16 pin connector, PD-30, http://www.cui.com/product/resource/pd-30.pdf connector 3-pin PD-30 power DIN 3-pin nonstandard DIN connector, shielded, PD-30S, http://www.cui.com/product/resource/pd-30s.pdf connector 3-pin PD-30 power DIN 3-pin.

New Pull Request