Labels Milestones
BackDSBGA, area grid, YBG pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch.
- Connector, 43160-2104, With thermal vias in pads.
- Highspeed card edge connector for PCB's with.
- Ins: Clock In .