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Width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600.

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