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(http://www.ti.com/lit/ds/symlink/msp430fr5720.pdf#page=108), generated with kicad-footprint-generator ipc_noLead_generator.py DFN6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 932AZ.PDF TQFP128 14x14 / TQFP120 CASE 932AZ (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1719.pdf DFN, 8 Pin (http://www.fujitsu.com/downloads/MICRO/fsa/pdf/products/memory/fram/MB85RS16-DS501-00014-6v0-E.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 72-Lead Frame Chip Scale Package LFCSP (5mm x 3mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic Small outline http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic.

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