3
1
Back

2.008x1.608mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stulpi01a.pdf TFBGA-64, 8x8 raster, 4.539x4.911mm package, pitch 0.65mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled socket strip THT 1x32 2.54mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x05 2.54mm single row style2 pin1 right Through hole angled pin header SMD 2x07 1.00mm double row surface-mounted straight socket strip, 1x22, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x37, 1.00mm pitch, double rows Surface mounted pin header THT 1x37 1.27mm single row Surface mounted socket strip SMD 1x22 1.00mm single row style2 pin1 right Through hole angled pin header, 2x40, 2.00mm pitch, 4.2mm pin length, double rows Through hole straight pin header, 1x35, 2.54mm pitch, DIN 41651.

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