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Row_7, 0]; cv_in_1b = [right_col, row_3, 0]; pwm_duty = [width_mm - h_margin - working_width/8, row_4, 0]; pwm_cv_lvl = [width_mm - h_margin - working_width/8, row_4, 0]; left_rib_x = hole_dist_side + thickness; right_rib_x = width_mm - thickness; left_panel_width = 16.5+16.5+10.5; //two knob, one jack, plus space between two resistors Properly assign potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flat, No Lead Package - 9x9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flat, No Lead Package (MD) - 4x4x0.9 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8 1EP ThermalVias WSON, 8 Pin (https://ww2.minicircuits.com/case_style/XX211.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 48 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation CD), generated with kicad-footprint-generator ipc_noLead_generator.py NXP LGA, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14), generated with kicad-footprint-generator TE, 2-826576-0, 20 Pins (http://www.molex.com/pdm_docs/sd/908140004_sd.pdf), generated with kicad-footprint-generator Molex SPOX.

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