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WLCSP-25, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid.

From e97ef3972850f598b56fc0365b7ac9a8c525cde5 Mon Sep 17 00:00:00 2001 Subject.
[PATCH] jesus and mo, maintenance if.
(360/RingMarkings)] cube([RingWidth*.5, MarkingWidth, 2.
BOM Optional capacitor socket Docs/precadsr_bom.md | 71 Docs/precadsr_layout_back.pdf.

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