Labels Milestones
BackST WLCSP-25, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA.
- MA -12 V ## Photos Images, docs.
- 0.594398 0.478901 0.646022 facet normal.
- (end 2.811 2.065 (end 2.811 2.065.
- 175.6975 111.75 (end 165.1 107.67.