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43160-2104, With thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-03P-1.25DS, 3 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator connector wire 0.5sqmm strain-relief Soldered wire connection, for 5 times 0.127 mm² wires, reinforced insulation, conductor diameter 0.9mm, length 10.0mm, width 3.5mm, e.g. Ettinger 13.13.890, https://katalog.ettinger.de/#p=434 Through hole socket strip THT 2x28 1.00mm double row surface-mounted straight socket strip, 2x38, 1.00mm pitch, double rows Surface mounted socket strip SMD 1x29 2.00mm single row Through hole angled pin header, 1x31, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header SMD 1x06 1.00mm single row Through hole.

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