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BackPackage, 4-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-Lead Plastic Dual Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 144 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator ipc_gullwing_generator.py DSO DSO-8 SOIC SOIC-8 Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf VSON, 10.
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