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*~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole Total plated holes unplated through holes: unplated through holes: ============================================================= From a22bca6d29ddc0a54597dab4d11ad9ab7e48e3c6 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Add splits and labels to get 1:1 between schematic and PCB, .../Unseen Servant/Unseen Servant.kicad_pro | 40 .../Unseen Servant/Unseen Servant.kicad_pro | 326 create mode 100644 Hardware/Panel/precadsr_panel_al/precadsr_panel_al.pro create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/SolderWirePad_1x01_Drill1mm.kicad_mod create mode 100644 3D Printing/Pot_Knobs/repere_v3.stl | 170 3D Printing/Pot_Knobs/scaled_french_pot.mix cube([board_width, board_height, thickness]); linear_extrude(thickness) polygon([[0,0], [(board_width-insert_width)/2, -insert_depth], [board_width-(board_width-insert_width)/2, -insert_depth], [board_width, 0]]); Update 'Samba Reggae 1' a704d3e530 More traces and vias, and this is good practice, but ho-dang what a mess More traces and vias, and this.

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