3
1
Back

PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm 8-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 18-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/ldc1312.pdf#page=59), generated with kicad-footprint-generator JST PH series connector.

New Pull Request