Labels Milestones
BackHLE-132-02-xxx-DV, 32 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator JST SHL series connector, 502386-1370 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 78171-0002 (http://www.molex.com/pdm_docs/sd/781710002_sd.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-135 , 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST SUR series connector, LY20-16P-DT1, 8 Circuits (https://www.molex.com/pdm_docs/sd/2005280080_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP8: plastic thin shrink small outline package; 44 leads; body width 4.4 mm; Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package - 4x4x0.9 mm Body [TQFP] With Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 8 leads; body width 6.1 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot361-1_po.pdf TSSOP, 28 Pin.
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