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Ipc_noLead_generator.py DD Package; 8-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic DFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf DFN, 8 Pin (http://ww1.microchip.com/downloads/en/AppNotes/S72030.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-2410, 24 Pins per row (http://suddendocs.samtec.com/prints/lshm-1xx-xx.x-x-dv-a-x-x-tr-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=164), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 1-770866-x, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_10_05-08-1722.pdf DFN, 10 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0429.PDF), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-118-02-xxx-DV-BE-A, 18 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, B3B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 5, Wuerth electronics 9774050960 (https://katalog.we-online.de/em/datasheet/9774050960.pdf,), generated with kicad-footprint-generator JST VH series connector, 64801011622 (https://katalog.we-online.com/em/datasheet/6480xx11622.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Kionix LGA, 12 Pin (http://www.ti.com/lit/ml/mpqf391c/mpqf391c.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-148-02-xxx-DV-LC, 48 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A https://www.onsemi.com/pub/Collateral/488AA.PDF ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 122BX.PDF 32-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 24-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body (see Atmel Appnote 8826 10-Lead Plastic Dual Flat No Lead Package (MA) - 2x2x0.9 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 14-lead surface-mounted (SMD) DIP package, row spacing 15.24.

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