Labels Milestones
BackM153 MBGA Altera BGA-153 M153 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 9.53 mm (375 mils), Clearance8mm 6-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 2x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils 5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 10.8x21.88mm 8x-dip-switch SPST , Piano, row spacing 22.86 mm (900 mils), SMDSocket, SmallPads THT.
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