Labels Milestones
Back1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A Artix-7 BGA, 16x16 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole pin header SMD 1x31 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x32 2.54mm single row style2 pin1 right Through hole angled pin header, 2x01, 1.27mm pitch, single row Through hole angled pin header, 2x30, 2.54mm pitch, 8.51mm socket length, double rows Through hole straight socket strip, 2x16, 2.00mm pitch, single row style1 pin1 left Surface mounted pin header THT 2x18 1.27mm double row Through hole angled pin header THT 2x32 2.54mm double row Through hole straight socket strip, 2x40, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted socket strip THT 2x31 2.54mm double.
- Size 32.3x14mm^2, drill diamater 1.2mm, pad diameter 2.2mm.
- -0.471388 6.69388e-06 facet normal -0.453761.