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UMS, see http://cdn-reichelt.de/documents/datenblatt/C300/UMS05_1A80_75L_DB.pdf Resistor SMD 0815 (2038 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32-Leads, Body 5x5x0.8mm, Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments EUK 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x16.8mm 6x-dip-switch SPST CTS_Series194-6MSTN, Piano, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 22-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil Socket 3M 28-pin zero insertion force socket, though-hole, row spacing 5.9 mm (232 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 11x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 32-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 12-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), LongPads 20-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 8x-dip-switch SPST Omron_A6H-8101, Slide, row spacing 7.62 mm (300 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 64-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size 9.78x22.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 8x-dip-switch SPST , Slide, row spacing 6.73 mm (264 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 4x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 8-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD.

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