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BackBody 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole vertical IDC box header THT 1x25 1.00mm.
- -9.122290e+01 9.519027e+01 4.255000e+01 facet normal -0.467809 0.312901 -0.826588.
- 2.437292e-05 vertex -9.857868e+01 1.059942e+02 4.255000e+01 facet normal 5.035427e-001.
- Https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, 3.2x2.5mm^2 package crystal Epson Toyocom FA-128 (https://support.epson.biz/td/api/doc_check.php?dl=brief_FA-128&lang=en.