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BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header SMD 2x01 2.54mm double row surface-mounted straight socket strip, 2x18, 1.27mm pitch, single row Through hole straight socket strip, 2x04, 2.54mm pitch, double rows Surface mounted pin header THT 2x09 1.27mm double row Through hole straight socket strip, 2x06, 1.27mm pitch, single row Through hole angled socket strip, 1x35, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x16 2.54mm double row Through hole straight socket strip, 1x10, 2.54mm pitch, 6mm pin length, double rows Surface mounted pin header THT 1x05 1.00mm single row style1 pin1 left Surface mounted pin header THT 2x03 2.00mm double row Through hole IDC header, 2x08, 2.00mm pitch, 6.35mm socket length, single row Through hole pin header THT 1x02 1.00mm single row male, vertical entry Harwin LTek Connector, 6 pins, pitch 5mm, size 66.5x15mm^2, drill diamater 1.3mm, pad diameter 3mm.

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