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0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled pin header, 1x33, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole pin header SMD 2x19 2.54mm double row Through hole IDC box header, 2x08, 1.00mm pitch, double rows Through hole angled pin header, 1x09, 2.00mm pitch, 4.2mm pin length, single row Surface mounted socket strip SMD 2x22 2.54mm double row.

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