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Vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf TSOP-I, 24 Pin (https://ams.com/documents/20143/36005/AS1115_DS000206_1-00.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief.

• Normal 0.00746316 0.0990468 -0.995055.
• -0.491333 0.632579 facet normal -4.120040e-001 -9.111820e-001 0.000000e+000.
• -0.946355 -0.307498 0.09928 facet normal.

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