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Back3EP 16.0x17.2mm Pitch 1mm ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm 8-Lead Plastic DFN (7mm x 4mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 6 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant BA), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times 2 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV.
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