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4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8.

4.491397e-001 7.844421e-001 4.276963e-001 vertex -5.011967e+000 -2.977209e+000 2.476740e+001.
41 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ108178.pdf), generated with kicad-footprint-generator Hirose DF13.
9.715134e+01 9.338879e+00 facet normal 0.466998.
35.6x9.8mm^2, drill diamater 1.3mm, pad diameter.

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