3
1
Back

DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row style2 pin1 right Through hole angled pin header, 2x23, 1.27mm pitch, 4.0mm pin length, single row male, vertical entry Harwin LTek Connector, 17 pins, single row style2 pin1.

New Pull Request