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Date Tue Mar 5 20:19:51 2024 Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole Total plated holes unplated through holes: merged pull request 'More schematics' (#3) from schematic by Eeschema 5.1.10-88a1d61d58~88~ubuntu20.04.1 **Component Count:** 75 0 0 Dual VCA, based roughly on Moritz Klein's schematic, with features added from Skull and Circuit's VCA v1.3. 3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/Panels/COLOR SPRAY.png' Delete '3D.

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