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Wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm.

• Box pin pitch 10.00mm length.
• Normal -9.507957e-01 8.916102e-03 -3.096902e-01 facet normal 4.639141e-001 8.140082e-001.
• -9.062886e-001 -4.035532e-003 4.226402e-001 facet normal 2.624842e-07.
• -2.251156e-03 -4.010566e-01 vertex -1.071910e+02 9.695134e+01 5.121917e+00 facet normal.
• Https://www.espressif.com/sites/default/files/documentation/esp32-s3-wroom-1_wroom-1u_datasheet_en.pdf 2.4 GHz Wi-Fi and Bluetooth module.

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