Labels Milestones
BackSmallPads 32-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 18-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), Socket.
- File donwn the top surface of the indenting.
- Height 4.1, Wuerth electronics 9774010982 (https://katalog.we-online.de/em/datasheet/9774010982.pdf.