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0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Quad Flatpack No-Lead (LZ) - 2x3x0.9 mm Body [HTSSOP], with thermal pad HTSSOP32: plastic thin shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 56.

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