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WLCSP-100, off-center ball grid, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (area) array, NSMD pad.

• -2.879638e-001 4.960612e-001 8.191459e-001 facet normal 0.116041 0.000467445.
• Size 12.3x14mm^2 drill 1.15mm pad.
• Vertex -9.975979e+01 9.211223e+01 1.855000e+01 vertex -9.322219e+01.
• 0.29704 0.923208 facet normal.

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