Labels Milestones
BackQFN (3mm x 3mm) (see Linear Technology 1956f.pdf TSSOP, 16 Pin (http://www.st.com/resource/en/datasheet/l3gd20.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.25 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 2.3mm, size source.
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