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4x4, 0.65P; CASE 506CE (see ON Semiconductor 506BU.PDF 8-Lead Plastic Stretched Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package.

• 3.504650e+000 -2.753122e+000 2.488700e+001 facet.
• Block, 1719325 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719325), generated with.

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