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Infrared LED diameter 3.0mm z-position of LED center 1.6mm, 2 pins, pitch 2.54mm, package size 32.2x9.1x15mm^3, https://www.recom-power.com/pdf/Innoline/R-5xxxPA_DA.pdf dc-dc recom buck sip-3 pitch 2.54mm length 7.6mm diameter 3.6mm Diode, DO-15 series, Axial, Vertical, pin pitch=5.08mm, , length*diameter=24*7.1mm^2, Vishay, IM-10-28, http://www.vishay.com/docs/34035/im10.pdf Inductor Axial series Axial Horizontal pin pitch 15mm length 11mm diameter 4.5mm Tantal Electrolytic Capacitor, , http://www.vishay.com/docs/28342/058059pll-si.pdf CP Radial series Radial pin pitch 20mm length 17mm diameter 7.0mm Tantal Electrolytic Capacitor CP Axial series Axial Vertical pin pitch 31.80mm length 67.6mm width 36.1mm Vishay TJ9 SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open, labeled with numbers SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 copper strip, labeled with numbers LUMILEDS LUXEON TX L1T2 LED LED 1W 3W 5W LED SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://datasheet.octopart.com/HVC0603T5004FET-Ohmite-datasheet-26699797.pdf), generated with kicad-footprint-generator Harwin Female Vertical Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89013xx, 13 Pins per row, Mounting: PCB Mounting Flange (http://www.molex.com/pdm_docs/sd/039291047_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py Halo N6 SO, 16 Pin package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm SMD DIP Switch SPST Slide 8.61mm 338mil SMD SMD 9x-dip-switch SPST , Slide, row spacing 5.9 mm (232 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 8x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 7x-dip-switch SPST KingTek_DSHP07TJ, Slide, row spacing 7.62 mm (300 mils), Socket 18-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 18-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera UBGA U169 BGA-169 BGA-200, 14.5x10.0mm, 200 Ball, 12x22 Layout, 0.8x0.65mm Pitch, http://www.issi.com/WW/pdf/43-46LQ32256A-AL.pdf Altera BGA-256 M256 MBGA BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf.

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