3
1
Back

Module 16-pin module, column spacing 22.86 mm (900 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 26.669999999999998mm 1050mil SMDSocket LongPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil 4-lead though-hole mounted.

New Pull Request