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HLE-108-02-xxx-DV, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 26-60-4110, 11 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP I, 28 pins, through hole 2.25mm, height 8, Wuerth electronics 9774035943 (https://katalog.we-online.de/em/datasheet/9774035943.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-36DP-0.5V, 36 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LGA 24L 3x3.5mm Pitch 0.43mm LGA 28 5.2x3.8mm Pitch 0.5mm Analog Devices (Linear Tech), 133-pin LGA uModule, 15.0x15.0x4.32mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf.

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