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BackModule 16-pin module, column spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Horizontal RM 1.7mm MultiwattF-11 staggered type-2 TO-220-7 Vertical RM 1.27mm Multiwatt-7 staggered type-1 TO-220-9 Vertical RM 2.54mm IIPAK I2PAK TO-262-5, Horizontal, RM 5.08mm, see https://www.centralsemi.com/PDFS/CASE/TO-220-2PD.PDF TO-220-2 Vertical RM 1.27mm staggered type-2 TO-220-4, Horizontal, RM 1.7mm, staggered type-1, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 2.54mm staggered type-1 TO-220-4 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-247-2, Horizontal, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Horizontal RM 0.97mm Multiwatt-9 staggered type-2 TO-220-15, Horizontal, RM.
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