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Raster, 4.039x3.951mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32l011k3.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout.

• Molex Panelmate series connector, B28B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf.
• | 958 .../precadsr-panel-holes.kicad_mod | 208.

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