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5 bump 2x1x2 array, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 16x16 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.4mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf 44-Lead Plastic Thin Quad Flatpack (MW) - 10x10x1.0 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 20 Pin (https://www.ti.com/lit/ds/symlink/tps2663.pdf#page=49), generated with kicad-footprint-generator JST ZE horizontal JST ZE series connector, LY20-32P-DT1, 16 Circuits (https://www.molex.com/pdm_docs/sd/2005280160_sd.pdf), generated with kicad-footprint-generator connector Molex MicroClasp Wire-to-Board System, 55932-0630, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-144-02-xx-DV-TE, 44 Pins (http://www.molex.com/pdm_docs/sd/5024260810_sd.pdf), generated with kicad-footprint-generator connector TE 826576 vertical TE, 1-826576-5, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.

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