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Instruments EUW 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 28-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP PDIP 2.54mm 10.16mm 400mil Socket LongPads 40-lead.

• -0.0980692 -0.99518 0 facet normal -0.468635.
• -6.483585e-002 2.494118e+001 facet normal -0.828706 0.0816226.
• 4.395874e-001 -7.536180e-001 4.886950e-001 vertex -3.455805e+000 2.660052e+000.

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