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M5 iso14580 Mounting Hole 6mm, no annular Mounting Hole 6.4mm, M6, DIN965 mounting hole 3.7mm no annular m4 din965 Mounting Hole 2.7mm, M2.5, ISO14580 mounting hole 4.3mm no annular m2.5 Mounting Hole 3.2mm, no annular, M3, ISO14580 mounting hole 6.4mm m6 iso7380 Mounting Hole 5.3mm, M5, ISO7380 mounting hole 6.4mm m6 iso14580 Mounting Hole 6mm, no annular m4 din965 Mounting Hole 4.3x6.2mm, M4 mounting screws (https://www.vishay.com/docs/95423/sot227g2.pdf, https://www.vishay.com/docs/95793/vs-fc420sa10.pdf TR TO-3 TO3 TO-204 TO-3P-3, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-247-2, Horizontal, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Horizontal RM 1.27mm MultiwattF-15 staggered type-1 TO-220-9, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 8x-dip-switch SPST KingTek_DSHP08TJ, Slide, row spacing 5.9 mm (232 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 1x-dip-switch SPST Omron_A6S-110x, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 11x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 6 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 2x-dip-switch SPST Omron_A6S-210x, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil 28-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil 8-lead dip package, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 14-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT.

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