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Package (UC) - 3x3x0.5 mm Body [HTSSOP], with thermal vias in pads, 3 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Soldered.

• Review "design_settings": { "defaults.
• Normal -0.090682 -0.920074 0.381103 facet normal 0.0825968 -0.0807457.
• -0.300158 -0.365745 0.880985 vertex 6.92976 -4.63032.

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