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Back*.lck # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ Initial version *.bck New KiCad version; non Al panel Gerbers pts New KiCad version; non Al panel Gerbers ) (filled_polygon New KiCad version; non Al panel Gerbers *~ New KiCad version; non Al panel Gerbers # Exported BOM files *.xml *.csv # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 Not plated through holes are merged with plated holes count 16 Not plated through holes: unplated through holes: ============================================================= c9e81f0cc630cea052574ce7c50b3e82145bb626 Image of.
- Normal -0.773045 -0.634352 -1.04068e-06.
- See http://omronfs.omron.com/en_US/ecb/products/pdf/en-g5v_1.pdf Relay SPDT Potter&Brumfield.
- Normal -0.0342449 -0.29048 0.956268.
- To U3-3 = capacitor measurement.