3
1
Back

12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUS 5 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole straight pin header, 2x09, 1.00mm pitch, single row style1 pin1 left Surface mounted socket strip THT 1x39 2.00mm single row style2 pin1 right Through hole angled pin header, 2x09, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 1x02 1.27mm single row Surface mounted socket strip SMD 1x02 2.00mm single row (from Kicad 4.0.7!), script generated Surface mounted pin.

New Pull Request