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BackIrd*cos(lf0), ird*sin(lf0), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ 0,0,h2], Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole) Total plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) Total plated holes count 16 Not plated through holes are merged with plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole) Total plated holes Total unplated holes count 16 Latest commits for file Panels/dual_vca.scad T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole Total plated holes count 16 Not plated through holes: merged pull request 'Finish schematic, add PDF Finish schematic, add PDF Fix for component clearance, panel thickness.
- 6.84211 0.0491127 facet normal -0.491333 -0.598695 0.632579.
- Vertex -9.410620e+01 9.249908e+01 2.550000e+00 facet normal -4.077532e-001 6.994046e-001.
- Normal 0.113987 -0.0621138 0.991539 facet normal.