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VQ, 24 pin, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row (from Kicad 4.0.7), script generated Through hole angled socket strip THT 2x23 1.00mm double row Through hole straight socket strip, 1x34, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x02 1.00mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x28 2.00mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x21, 2.54mm pitch, double rows Surface mounted socket strip THT 2x01 1.27mm double row Through hole straight pin header.

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