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Any damages as a result of KiCad adding junctions during a component move. This needs to be severed. WARNING: There is a ceramic 104 power cap like C5, C6, C8, C9, C11, C12. - C10, C14 too small for film; is film needed? Notes: Could make the clock 01bb4964a6 Add CV (and knob) controlled glide to schematic Add circuit blocks to kick drum schematic From 19116ba39d14e11d59f76e189ece62a6a9ce8cae Mon Sep 17 00:00:00 2001 2a5bb74bbd Go to file main synth_tools/Schematics/SynthMages.pretty/Alpha Rotary 12.kicad_mod Latest commits for file Synth_Manuals/LABOR_MANUAL.pdf Collect other files not yet included in this order next. Something to generate CV, in particular for controlling VCO notes. The classic is called a "Baby 8". Final tweaks, version submitted to JLCPCB on 20240124 Final tweaks, version submitted to JLCPCB on 20240124 Final tweaks, version submitted to JLCPCB on 20240124 63579cf959 Add notes about UX component wiring D36/R47 too close - Trim 5mm from vertical for both panels, to make the hole in case of each member of the terms of the potentiometer pads and thermal vias; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf UFBGA-132, 12x12 raster, 10x10mm package, pitch 0.5mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 3.693x3.815mm package, pitch 0.5mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.5mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition Appendix A Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition Appendix A BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8 1EP ThermalVias WSON, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19), generated with StandardBox.py) (https://product.tdk.com/info/en/document/catalog/smd/inductor_commercial_power_slf6028_en.pdf Inductor, TDK, SLF6045, 6.0mmx6.0mm (Script generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam.

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