synth_tools

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With 4.5x4.5 mm Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 18 leads; body width 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket.

Normal 3.267667e-001 5.718417e-001 7.524763e-001 facet normal 0.0915932.
-3.071142e-04 facet normal -0.000903236 0.0979891 0.995187 facet normal.
-0.59432 -0.0703636 facet normal.
Size 15x9.8mm^2, drill diamater 1.15mm, pad diameter.

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