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14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 48-lead though-hole mounted DIP package, row spacing 7.62.

• Code form that contains any Covered Software is.
• MC_1,5/11-GF-3.5; number of pins: 06; pin pitch.

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