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BM12B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a single 1 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex CLIK-Mate series connector, 502386-1470 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-168 , 8 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator JST PUD series connector, BM05B-ACHSS-A-GAN-ETF (http://www.jst-mfg.com/product/pdf/eng/eACH.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 0.1 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 3.5mm, hole diameter 1.3mm, wire diameter 0.8mm wire loop as test Point, diameter 1.0mm test point THT pad rectangle square SMD pads Net tie, 3 pin, 0.3mm round THT pads Net tie, 2 pin, 0.5mm square SMD pads Net tie, 3 pin, 2.0mm square SMD pads Net tie, 2 pin, 2.0mm square SMD pads Net tie, 4 pin, 0.5mm square SMD pads Net tie, 4 pin, 1.0mm round THT pads Net tie, 4 pin, 0.5mm square SMD pads Net tie, 3 pin, 0.3mm round THT pads Net tie, 2 pin, 1.0mm round THT pads Net tie, 2 pin, 1.0mm round THT pads Net tie, 3 pin, 0.5mm square SMD pads Net tie, 4 pin, 0.5mm square SMD pads Net tie, 2 pin, 0.3mm round THT pads Laser Gaming Sensor ADNS-9800 Fiberoptic Transmitter TX, HFBR series (https://docs.broadcom.com/docs/AV02-3283EN Fiberoptic Receiver RX, HFBR series (https://docs.broadcom.com/docs/AV02-3283EN TSL2550 ambient light sensor, i2c interface, 6-pin chipled package, http://optoelectronics.liteon.com/upload/download/DS86-2013-0004/LTR-303ALS-01_DS_V1.pdf Optoisolator with LED and photoresistor 3 Lead Plastic Package OnSemi CASE 100CY, light-direction upwards, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105.pdf package for diode bridges, row spacing 7.62 mm (300 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 3x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 2.54mm 22.86mm 900mil 64-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD DIP DIL ZIF 7.62mm 300mil LongPads 4-lead though-hole mounted.

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