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205-00056, 45Degree (cable under 45degree), 36 pins, pitch 3.5mm, size 42x7.6mm^2, drill diamater 1.3mm, pad diameter 3mm, see http://www.metz-connect.com/de/system/files/METZ_CONNECT_U_Contact_Katalog_Anschlusssysteme_fuer_Leiterplatten_DE_31_07_2017_OFF_024803.pdf?language=en page 133, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix MKDS-3-9-5.08, 9 pins, pitch 5.08mm, size 40.6x10.6mm^2, drill diamater 1.15mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix MKDS-1,5-12, 12 pins, pitch 5mm, size 20x9mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.4uconnector.com/online/object/4udrawing/10705.pdf, script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block WAGO 236-136, 45Degree (cable under 45degree), 5 pins, pitch 10mm, size 115x8.1mm^2, drill diamater 1.3mm, pad diameter 2.3mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 53048-1210, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 4.5, Wuerth electronics 9775116360 (https://katalog.we-online.com/em/datasheet/9775116360.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 1-794071-x, 11 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4120, 12 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator connector JST ZE series connector, B11B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283), generated with kicad-footprint-generator JST PUD series connector, SM09B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 1.5 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius.

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